We have made professional Technology
product
laser assisted bonder
Assisted
Bonder
PLA-400RT
LOW THERMAL STRESS AND LESS WARPAGE BONDING TECHNOLOGY
EFFECTIVE FOR THIN SUBSTRATES DUE TO SELECTIVE HEATING CAPABILITY
STABLE INTERCONNECTION QUALITY WITH VARIOUS PACKAGE TYPES
EXCELLENT FOR DOWNSIZING PRODUCTION SPACE AND COST SAVINGS
-
Substrate loading
(Die mounted) -
-
Pick up die &
vision aligning
(Top and bottom) -
-
Re-bonding
(X-Y-T align) -
-
Compression &
laser emission
(Z motion control) -
-
Releasing head
& substrate
unloading
| Items | Specification |
|---|---|
| Laser Type | IR Laser |
| Wavelength | 980nm (Near Infrared) |
| Output Power | 4000W |
| Homogenizer beam size | 25x25~65x65mm |
| Gantry Resolution | 1um |
| Beam center position accuracy | 500μm |
| Beam width | Within 2.5mm |
| Flatness of stage | Bonding stages 25um |
| Stage Temperature | Max. 150 ±5°C (Pre-heat) |
| Max working zone | 310x160x4.5mm |
| Machine Foot Print | 1,500x1,500x1,900 (W x L x H) |
Environment and
sustainability
Even smaller,
but still powerful